RBC-3900 is a low viscostiy epoxy system designed for potting and encapsulating electrical and electronic components. It offers excellent moisture resistance, convenient mix ratio of 1:1, very low viscosity and excellent thermal shock characteristics.
Mixed Viscosity @ 25oC, cps: 1,000
Shelf Life, (closed Container @ 25oC): 12 months
Color: Black
Specific Gravity @ 25oC: 1.14
Hardness, Shore D: 83
Linear Shrinkage, in./in.: 0.002
Moisture Absorption 10 Days @ 25oC, %: 0.02
Izod Impact Strength, ft. lbs./in. of notch: 0.60
Tensile Strength @ 25oC, psi: 6,550
Compressive Strength @ 25oC, psi: 18,900
THERMAL PROPERTIES (CURED):
Thermal Conductivity, cal/sec/cm2/oC/cm X 10-4: 5.0
Thermal Stability, 1000 Hrs. @ 175oC, % Wt. Loss: 4.8
Coefficient of Thermal Expansion, in./in./oC X 10-6: 62
Heat Distortion Temperature, oC: 70
Operating Temperature Range, oC: -50 to 130
Volume Resistivity @ 25oC, ohm-cm: 8×1012
Dielectric Strength, volts/mil: 475
Dielectric Constant @ 25oC, 100 KC: 4.10
Dissipation Factor @ 25oC, 100 KC: 0.055
Weigh the desired amount of #3900 Epoxy Resin into a clean container and combine with recommended amount of #3900 Epoxy Hardener. Mix thoroughly. Entrapped air may be removed by vacuum.
| Mix Ratio by Weight or Volume | 100 parts resin to 100 parts hardener | |
| Pot Life | @ 25oC | 50-60 minutes |
| Cure Time | @ 25oC | 72 hours |
| @ 65oC | 1-2 hours | |
| @ 100oC | 30 minutes |
