RBC-3800 Resin

Electronics
, Potting & Encapsulating
1 week
Pot Life
3,500
Mixed Viscosity (cps)
55
Hardness (Shore D)
-65 to 130
Operating Temperature Range (°C)

RBC-3800 epoxy system is an unfilled, low viscosity, semi-flexible epoxy system used for epoxy potting and encapsulating and/or insulating a variety of electronic components. RBC-3800 exhibits excellent impact and thermal shock resistance and its electrical and physical properties are stable at 130oC continuous operation. The #3800 system is also available in a pigmented version to help insure a proper mix.

HANDLING PROPERTIES:

Mixed Viscosity @ 25oC, cps: 3,500

Shelf Life, (closed Container @ 25oC): 12 months

PHYSICAL PROPERTIES (CURED):

Color: Translucent
Specific Gravity @ 25oC: 1.10
Hardness, Shore D: 55
Linear Shrinkage, in./in.: 0.008
Moisture Absorption 10 Days @ 25oC, %: 0.81
Izod Impact Strength, ft. lbs./in. of notch: 1.40
Tensile Strength @ 25oC, psi: 2,100
Compressive Strength @ 25oC, psi:  3,000

THERMAL PROPERTIES (CURED):

Thermal Conductivity, cal/sec/cm2/oC/cm X 10-4: 5.5
Thermal Stability, 1000 Hrs. @ 175oC, % Wt. Loss: 3.20
Coefficient of Thermal Expansion, in./in./oC X 10-6: 85
Heat Distortion Temperature, oC: 35
Operating Temperature Range, oC: -65 to 130

ELECTRICAL PROPERTIES (CURED):

Volume Resistivity @ 25oC, ohm-cm: 8×1015
Dielectric Strength, volts/mil: 400
Dielectric Constant @ 25oC, 100 KC: 4.80
Dissipation Factor @ 25oC, 100 KC: 0.0016

MIXING INSTRUCTIONS:

Weigh the desired amount of #3800 Epoxy Resin into a clean container and combine with recommended amount of #3800 Epoxy Hardener. Mix thoroughly. Entrapped air may be removed by vacuum.

RECOMMENDED CURE SCHEDULE:

Mix Ratio by Weight 100 parts resin to 200 parts hardener  
Pot Life @ 25oC 1 week
  @ 65oC 12 hours
  @ 100oC 30 minutes

 

Cure Time @ 75oC 15-20 hours
  @ 95oC 6-8 hours
  @ 120oC 2-3 hours